Applied Graphene Materials launches graphene-enhanced thermally conductive epoxy paste adhesives

Applied Graphene Materials recently added new adhesive materials to their portfolio, aimed at the Space and Defense sectors. These are said to be two unique graphene-enhanced thermally conductive epoxy paste adhesive systems, called AGM TP300 and AGM TP400

These novel epoxy adhesive systems reportedly exhibit high levels of thermal conductivity (between 3 and 6 W/mK), combined with excellent mechanical, adhesive and outgassing performance. Most significantly these properties are achieved with cured resin densities as low as 40% that of competitive conductive adhesives on the market. AGM’s TP 300/400 products are therefore highly versatile, while providing end users with significant savings in both mass and cost.

AGM’s TP 300/400 systems are said to be ideal for use where thermal management is critical in structural bonding or gap filling, across a range of satellite and general space applications.

TP300/400 adhesives are supplied in 2 pack resin and hardener systems. They are supported by an extended performance database, available on short lead-times and supplied in convenient kit sizes to suit customer requirements.