Applied Graphene Materials recently added new adhesive materials to their portfolio, aimed at the Space and Defense sectors. These are said to be two unique graphene-enhanced thermally conductive epoxy paste adhesive systems, called AGM TP300 and AGM TP400
These novel epoxy adhesive systems reportedly exhibit high levels of thermal conductivity (between 3 and 6 W/mK), combined with excellent mechanical, adhesive and outgassing performance. Most significantly these properties are achieved with cured resin densities as low as 40% that of competitive conductive adhesives on the market. AGM’s TP 300/400 products are therefore highly versatile, while providing end users with significant savings in both mass and cost.
AGM’s TP 300/400 systems are said to be ideal for use where thermal management is critical in structural bonding or gap filling, across a range of satellite and general space applications.
TP300/400 adhesives are supplied in 2 pack resin and hardener systems. They are supported by an extended performance database, available on short lead-times and supplied in convenient kit sizes to suit customer requirements.