Malaysian deep tech startup nanoSkunkWorkX (nSWX) has raised US$2 million in seed funding led by Singapore's Tin Men Capital, its first investment in a Malaysian startup, to advance a graphene-copper thin-film technology aimed at improving heat and current management inside AI chip packaging.
nSWX's lead product, nSD-I, is a thin-film interface designed to help copper interconnects carry more current and spread heat more effectively without replacing copper itself or requiring changes to existing manufacturing equipment and processes. The company says peer-reviewed testing found its graphene-copper films moved heat across their surface more than twice as effectively as a plain copper baseline, and that follow-up testing showed the performance advantage held up after the material was used in pre-qualification components.
The new funding will go toward qualifying nSWX with semiconductor partners, scaling its interface-engineering platform, and advancing its hydrogen and diagnostics programs across Asia. It builds on earlier backing from Gobi Dana Impak and Kumpulan Modal Perdana, on top of which nSWX says it developed its core platform, built out three product lines, and generated its first revenue using less than $1.5 million in external pre-seed capital.
"The cost of building and operating AI infrastructure can be dramatically reduced through small efficiency gains at the process step level, and for us, the opportunity lies in improving how the copper inside the packaging carries current, heat, and signals. This round will allow us to prove to industry partners just how transformative that small step can be," said Iqbal Shamsul, co-founder and CEO of nanoSkunkWorkX.
