Destination 2D brings graphene to mainstream CMOS
A semiconductor startup called Destination 2D has announced it has successfully achieved wafer-scale synthesis of high-quality graphene within CMOS-compatible process conditions. In doing so, the company is enabling the use of graphene as a 2D material in mainstream semiconductor products through its 300mm scale graphene synthesis equipment – the CoolC GT300™.
The issues facing the semiconductor industry as they relate to interconnects are profoundly impacted by the ever-shrinking dimensions of regular process technology. The standard interconnect material, copper, has been used for the past 30 years and is now reaching commercial end-of-life due to Moore’s Law and electron migration that renders copper extremely problematic in low geometry fabrication. At sub-15 nm interconnect dimensions, the resistivity of copper increases rapidly – causing significant degradation in both circuit and system-level performance, power, and dramatically impacting all reliability metrics required by modern semiconductor designs in products such as GPUs, CPUs and others.