As electronics keep shrinking in size, several problems arise. One of these is that the copper wires that connect transistors to form complex circuits need to be very thin, but carry so much current that can cause them to break apart due to atoms being knocked out of place. One way of solving this, studied by a group led by Stanford University, is to wrap copper with graphene. The group found that this can alleviate this major problem called electromigration.
This was presented at a recent IEEE meeting that addressed the coming problems for copper interconnects and debated ways of getting around them. Growing graphene around copper wires can help prevent electromigration, and also seems to bring down the resistance of the copper wires. Generally speaking, the narrower the wire, the higher its resistance. “Interconnects have had to shrink while increasing the current densities by 20 times,” said Intel Fellow Ruth Brain at the meeting.